TEMPERATURE-COMPENSATED OSCILLATOR AND MANUFACTURING METHODS THEREOF

摘要

A temperature compensated oscillator and a method for manufacturing the same are provided to remove an extra temperature compensation process by installing an IC chip on a package and inputting a normal value of temperature compensation data to the IC chip. An IC chip including an oscillator and a temperature compensation unit is installed in a package(S505). A normal value of temperature compensation data is inputted to a memory unit of the temperature compensation unit(S510). A piezoelectric element is installed in the package to oscillate a desired frequency(S515). A oscillation frequency of the piezoelectric element is adjusted to the desired frequency(S520). The package is sealed(S525). After the step(S525), the normal value of temperature compensation inputted to the memory unit is revised.