发明名称 |
Off-chip LC circuit for lowest ground and VDD impedance for power amplifier |
摘要 |
Off-chip LC circuit for lowest ground and VDD impedance for power amplifier. A novel approach is made by which a chip to PCB (Printer Circuit Board) interface may be made such that the ground and VDD potential levels are effectively brought onto the die of the chip such that a true ground potential is maintained within the chip. This off-chip LC circuit operates cooperatively with an on-chip decoupling capacitor to reduce the overall effective inductance of the bond wires employed to bring signal and voltage levels from the die to the chip exterior. This circuit ensures a relatively low impedance for a PA (Power Amplifier) that is implemented within chip thereby providing for improved performance.
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申请公布号 |
US7119631(B2) |
申请公布日期 |
2006.10.10 |
申请号 |
US20040844237 |
申请日期 |
2004.05.12 |
申请人 |
BROADCOM CORPORATION |
发明人 |
CASTANEDA JESUS ALFONSO;LI QIANG (TOM) |
分类号 |
H03H7/38;H03F1/56;H03F3/195;H03F3/24 |
主分类号 |
H03H7/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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