发明名称 Electroplating reactor
摘要 A reactor for electroplating a workpiece includes a vessel having a ring contact arranged to support a workpiece in a horizontal orientation. In an embodiment of the invention, an electrode is arranged below the ring contact, and a pressing member is arranged above the ring contact to press a workpiece into electrical engagement with the ring contact. The vessel may be adapted to contain an electroplating fluid between a top of the ring contact and the electrode. In one embodiment, a movable intermediate workpiece support assembly is carried by the vessel, the support assembly being actuatable to lower a workpiece carried thereby to deliver the workpiece to be supported accurately and precisely on the ring contact.
申请公布号 US7118658(B2) 申请公布日期 2006.10.10
申请号 US20020154426 申请日期 2002.05.21
申请人 SEMITOOL, INC. 发明人 WOODRUFF DANIEL J.;HANSON KYLE M.
分类号 C25C7/00;C25D7/12;C25D17/00;C25D17/06 主分类号 C25C7/00
代理机构 代理人
主权项
地址