发明名称 TAB TAPE FOR TAPE CARRIER PACKAGE
摘要 A TAB(Tape Automated Bonding) tape for a TCP(Tape Carrier Package) is provided to prevent the generation of short between adjacent metal lines by distributing the stress converged to a connection portion between first and second leads using a predetermined hole structure. A base film has a chip mounting region for loading a semiconductor chip. A metal line pattern is formed on the base film. The metal line pattern is composed of a plurality of first leads(130), a plurality of second leads(140) and a plurality of connection portions(150) for connecting the first and second leads with each other. A first hole(160) for exposing the base film to the outside is formed on the shortest connection portion and the second lead connected with the shortest connection portion. A second hole is formed at a predetermined portion adjacent to a boundary between the shortest connection portion and the first lead connected with the shortest connection portion.
申请公布号 KR100634238(B1) 申请公布日期 2006.10.09
申请号 KR20050074256 申请日期 2005.08.12
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SHIN, NA RAE;KIM, DONG HAN
分类号 H01L21/60 主分类号 H01L21/60
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