发明名称 |
TAB TAPE FOR TAPE CARRIER PACKAGE |
摘要 |
A TAB(Tape Automated Bonding) tape for a TCP(Tape Carrier Package) is provided to prevent the generation of short between adjacent metal lines by distributing the stress converged to a connection portion between first and second leads using a predetermined hole structure. A base film has a chip mounting region for loading a semiconductor chip. A metal line pattern is formed on the base film. The metal line pattern is composed of a plurality of first leads(130), a plurality of second leads(140) and a plurality of connection portions(150) for connecting the first and second leads with each other. A first hole(160) for exposing the base film to the outside is formed on the shortest connection portion and the second lead connected with the shortest connection portion. A second hole is formed at a predetermined portion adjacent to a boundary between the shortest connection portion and the first lead connected with the shortest connection portion. |
申请公布号 |
KR100634238(B1) |
申请公布日期 |
2006.10.09 |
申请号 |
KR20050074256 |
申请日期 |
2005.08.12 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SHIN, NA RAE;KIM, DONG HAN |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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