| 发明名称 |
THERMAL PROTECTION FOR ELECTRONIC COMPONENTS DURING PROCESSING |
| 摘要 |
<p>A method and device for cooling an electronic component during its manufacture, repair, or rework. There is a cooling unit in thermal communication with the electronic component which extracts heat therefrom.</p> |
| 申请公布号 |
EP1706750(A2) |
申请公布日期 |
2006.10.04 |
| 申请号 |
EP20050705656 |
申请日期 |
2005.01.13 |
| 申请人 |
COOKSON ELECTRONICS, INC. |
发明人 |
RAE, ALAN;SINGH, BAWA |
| 分类号 |
G01R31/02;H01L21/60;H01L23/36 |
主分类号 |
G01R31/02 |
| 代理机构 |
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