发明名称 |
Method for producing a semiconductor-molding tablet |
摘要 |
<p>A method for producing a semiconductor-molding tablet, which can reduce formation of voids in the package due to increased density of the tablet. The method comprises a step of kneading an epoxy resin composition comprising components (A) an epoxy resin, (B) a phenol resin, and (C) an inorganic filler as essential components, a step of roll-molding the resulting kneaded composition into a sheet shape having a sheet density ratio of 98% or more, a step of pulverizing the resulting sheet-shaped compact, and a step of forming the pulverized material into a tablet shape having a tablet density ratio of 94% or more and less than 98%.</p> |
申请公布号 |
EP1498244(B1) |
申请公布日期 |
2006.10.04 |
申请号 |
EP20040016747 |
申请日期 |
2004.07.15 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
OONO, HIROFUMI;YAMANE, MINORU;INA, YASUNOBU;UMENO, SHOUICHI |
分类号 |
B29B9/08;H01L21/56;B29B9/04;B29B9/10;B29B9/12;B29C45/46;H01L23/28;H01L23/29 |
主分类号 |
B29B9/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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