SENSOR SUBSTRATE AND METHOD OF FABRICATING SAME

摘要

A substrate (16) with hermetically sealed vias (18) extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side o f the substrate from another. One sideof the substrate may include a sensing element (12) and another side of the substrate may include sensing electroni cs (14).