发明名称 Semiconductor device and fabrication process thereof
摘要 <p>A semiconductor device includes a semiconductor substrate of a first conductivity type, a well of the first conductivity type formed in the semiconductor substrate, a transistor formed in the well, a diffusion region of a second conductivity type formed in the semiconductor substrate so as to cover a lateral side and a bottom edge of the well, a terminal formed on the semiconductor substrate at an outside part of the diffusion region, and a conductive region contacting with the well, the well being in ohmic contact with the terminal via the conductive region and the semiconductor substrate, the conductive region having an impurity concentration level exceeding an impurity concentration level of the semiconductor substrate.</p>
申请公布号 EP1708273(A2) 申请公布日期 2006.10.04
申请号 EP20050015045 申请日期 2005.07.12
申请人 FUJITSU LIMITED 发明人 TANAKA, TAKUJI;NOMURA, HIROSHI;IRIYAMA, YASUNORI
分类号 H01L29/10;H01L21/336 主分类号 H01L29/10
代理机构 代理人
主权项
地址