发明名称 Method of fabricating a semiconductor device and a method of generating a mask pattern
摘要 At least a groove for separating a semiconductor substrate into a first region of a relatively large area and a second region of a relatively small area is formed. An insulating film is formed on the surface of the semiconductor substrate including the interior of the groove. The insulating film is etched using an etching mask having a lattice window pattern in such a manner that openings corresponding to the lattice window pattern are formed in the first region. As an alternative, openings corresponding to a single opening pattern are formed in the first region using an etching mask having the single opening pattern and the lattice window pattern, and the insulating film is etched in such a manner that openings corresponding to the lattice window pattern are formed in the second region. In both cases, the remaining insulating film is polished off.
申请公布号 US7115478(B2) 申请公布日期 2006.10.03
申请号 US20030663642 申请日期 2003.09.17
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 MUKAI KIYOHITO;TANIMOTO TADASHI;ITO MITSUMI
分类号 H01L21/76;G06F17/50;H01L21/304;H01L21/3105;H01L21/762 主分类号 H01L21/76
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