发明名称 Sensor device and ceramic package for mounting electronic components
摘要 A sensor device includes a G sensor producing an electric signal in accordance with physical displacement of its sensing portion and a casing mounting this G sensor. A casing chamber is sealed with a potting material so that the G sensor is covered with the potting material. The potting material has the role of surely damping the high-frequency vibration which generally causes resonance. Thus, the G sensor can accurately detect the collision and vibration without being adversely influenced by the resonance.
申请公布号 US7116215(B2) 申请公布日期 2006.10.03
申请号 US20040765882 申请日期 2004.01.29
申请人 DENSO CORPORATION 发明人 OONISHI JUN
分类号 B60Q1/00;B60R21/01;B60R21/013;G01D11/24;G01D11/30;G01H1/00;G01P1/02 主分类号 B60Q1/00
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