| 摘要 |
A fixing apparatus for molding a semiconductor package is provided to fix the semiconductor package with a predetermined strength and to reduce the whole volume of the fixing apparatus by simultaneously fixing every semiconductor package placed on a placing plate. Both sides of a frame(110) are opened. A placing groove of placing plate and a placing groove of pressing plate are arranged on front and rear sidewalls the frame from a lower portion thereof by turns. An placing plate(120) is inserted into and placed in the placing groove of placing plate when a semiconductor package is placed. A pressing plate(140) is inserted into the placing groove of pressing plate. The pressing plate is adhered closely to an upper wall of the placing groove of pressing plate by a spring. A pressing member is mounted on a lower portion of the pressing plate to press the semiconductor package and to adhere it to the placing plate. A shield cover(150) is coupled to both sides of the frame to shield the both opened units of the frame. A dropping unit(160) of pressing plate is mounted to the shield cover to drop the pressing plate by force.
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