| 摘要 |
A connecting structure of a plasma display panel (PDP) and a flexible printed board (FPC board) in which migration of the Ag electrode of the PDP is prevented, and a method for connecting the electrode of the PDP and the wiring terminal of the FPC board through anisotropic conductive adhesive (ACF) by heating/pressing using a pressure-bonding tool. Assuming the width of the pressure-bonding tool (40) is a, the width of the overlapped portion of the electrode (3) and the wiring terminal (12) is b, the distance from the FPC substrate- side edge of the pressure-bonding tool to the electrode end part is c, the distance from the FPC substrate side edge of the pressure-bonding tool to the end part of a coverlay (13) is d, the width of the ACF (20) after connection is e, the distance from the PDP-side edge of the pressure-bonding tool to the end part of the wiring terminal is f, and the average particle diameter of conductive particles contained in the ACF is m, heating/pressing is performed in the following positional- relation arrangement; a>=e>=b, c>=0, f>=0, d:m=20:1-200:1. |
