| 摘要 |
PURPOSE: A semiconductor device is provided to prevent cracks from being generated at a first connection between a through part and a front surface electrode or a second connection between the through part and a rear surface electrode due to thermal-stress by forming a groove on a rear surface of a support substrate. CONSTITUTION: A semiconductor device(10) includes a support substrate(11), front and rear surface electrodes, a plurality of through parts, a semiconductor device, and a sealing resin. The front and rear surface electrodes(13,14) are formed on a front surface and a rear surface of the support substrate, respectively. Each through part(15) is used for connecting the front surface electrode with the rear surface electrode. The semiconductor device(16) for contacting electrically the front surface electrodes is fixed on the front surface of the support substrate. The sealing resin(18) is used for sealing the semiconductor device. A plurality of grooves(12) are formed on the rear surface of the support substrate. |
