发明名称 |
DISPOSITIF A SEMICONDUCTEUR DU TYPE A SEPARATION DIELECTRIQUE ET PROCEDE DE FABRICATION |
摘要 |
A dielectric isolation type semiconductor device and a manufacturing method therefor achieve high dielectric resistance while preventing the dielectric strength of the semiconductor device from being limited depending on the thickness of a dielectric layer and the thickness of a first semiconductor layer. A semiconductor substrate ( 1 ) and an n<SUP>-</SUP> type semiconductor layer ( 2 ) are bonded to each other through a buried oxide film layer ( 3 ). A first porous oxide film area ( 10 ) is formed in the semiconductor substrate in a state contacting with the buried oxide film layer. A power device is formed on the n<SUP>-</SUP> type semiconductor layer. The first porous oxide film area is formed in an area including a location right under a first main electrode ( 6 ) and extending from the first main electrode side up to a range of more than 40% of a distance (L) between the first and second main electrodes ( 6, 7 ). |
申请公布号 |
FR2863770(B1) |
申请公布日期 |
2006.09.29 |
申请号 |
FR20040013029 |
申请日期 |
2004.12.07 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
AKIYAMA HAJIME;IZUO SHINICHI |
分类号 |
H01L21/02;H01L21/336;H01L21/762;H01L23/60;H01L27/12;H01L29/06;H01L29/40;H01L29/739;H01L29/745;H01L29/78;H01L29/786 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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