发明名称 |
Multifunction lead frame and integrated circuit package incorporating the same |
摘要 |
The present invention provides a lead frame for use in packaging a circuit having a discrete component, and a method of manufacture thereof. In one embodiment, the lead frame includes a lead support structure and a plurality of severable leads that are coupled to the lead support structure. The plurality of severable leads extend inward from the lead support structure to predetermined locations corresponding to terminals of the discrete component. <IMAGE> |
申请公布号 |
SG125047(A1) |
申请公布日期 |
2006.09.29 |
申请号 |
SG20000005669 |
申请日期 |
2000.10.03 |
申请人 |
LUCENT TECHNOLOGIES INC. |
发明人 |
LOTFI ASHRAF WAGIH;WELD JOHN DAVID |
分类号 |
H01L25/18;H01L23/495;H01L23/50;H01L25/04 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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