发明名称 A MOULD FOR AN ENCAPSULATION APPARATUS AND METHOD FOR USING THE SAME.
摘要 THE PRESENT INVENTION RELATES TO A MOULD HAVING A HOLDINGS MEANS FOR HOLDING A LEAD FRAME TO A MOULD CHASE DURING MOULDING OF SAID LEAD FRAME, AND METHOD FOR USING THE SAME. THE METHOD COMPRISES POSITIONING THE LEAD FRAME (10) ON A BOTTOM MOULD CHASE (12), BRINGING THE TOP MOULD CHASE (11) AND THE BOTTOM CHASE (12) TOGETHER IN ORDER FOR ENCAPSULATION AND INTRODUCING AN ENCAPSULATING MATERIAL TO THELEAD FRAME (10) . THE PRESENT INVENTION DIFFERS FROM PRIOR PRACTICE BY HAVING A VACUUM SUCTION TO HOLD THE LEAD FRAME (10) TO THE BOTTOM MOULD CHASE (12).
申请公布号 MY126047(A) 申请公布日期 2006.09.29
申请号 MYPI20003111 申请日期 2000.07.07
申请人 CARSEM SEMICONDUCTOR SDN. BHD. 发明人 TENG LOY SING;CHIA PENG SENG;ONG KING HOO
分类号 B29C39/00 主分类号 B29C39/00
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