发明名称 |
A MOULD FOR AN ENCAPSULATION APPARATUS AND METHOD FOR USING THE SAME. |
摘要 |
THE PRESENT INVENTION RELATES TO A MOULD HAVING A HOLDINGS MEANS FOR HOLDING A LEAD FRAME TO A MOULD CHASE DURING MOULDING OF SAID LEAD FRAME, AND METHOD FOR USING THE SAME. THE METHOD COMPRISES POSITIONING THE LEAD FRAME (10) ON A BOTTOM MOULD CHASE (12), BRINGING THE TOP MOULD CHASE (11) AND THE BOTTOM CHASE (12) TOGETHER IN ORDER FOR ENCAPSULATION AND INTRODUCING AN ENCAPSULATING MATERIAL TO THELEAD FRAME (10) . THE PRESENT INVENTION DIFFERS FROM PRIOR PRACTICE BY HAVING A VACUUM SUCTION TO HOLD THE LEAD FRAME (10) TO THE BOTTOM MOULD CHASE (12).
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申请公布号 |
MY126047(A) |
申请公布日期 |
2006.09.29 |
申请号 |
MYPI20003111 |
申请日期 |
2000.07.07 |
申请人 |
CARSEM SEMICONDUCTOR SDN. BHD. |
发明人 |
TENG LOY SING;CHIA PENG SENG;ONG KING HOO |
分类号 |
B29C39/00 |
主分类号 |
B29C39/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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