| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce a circuit area on a surface mount circuit board, ensure secured mounting of surface mount components, and facilitate to yield an excellent fillet. <P>SOLUTION: The mounting method of surface mount components comprises the steps of performing the soldering paste printing which prints soldering pastes 33a and 33b on a surface mount circuit board 31 with soldering lands 32a and 32b formed; adhesively bonding the surface mount components which attaches a surface mount component 34 on the soldering paste 33a, and attaches a small-sized surface mount component 38 on the soldering paste 33b; adhesively bonding the soldering chip wherein a soldering chip 35 is transported to a flux vessel for immersion and flux coating, then the resulting flux-coated soldering chip 35 is attached to a terminal electrode on the surface mount component 34; and performing reflow which melts the soldering pastes 33a, 33b and the soldering chip 35 in a reflow furnace for soldering of the surface mount circuit board 31. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
