| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce radiatioin noise produced in a multilayer printed circuit board. <P>SOLUTION: A multilayer printed circuit board 8 has a ground layer, a signal layer, and a power supply layer for supplying supply voltage to mounted circuit elements laminated with insulating material in-between. Regions (planes 4) where the power supply layer and the ground layer are opposed to each other are formed of evenly divided regions having an identical shape and an identical area. Each evenly divided region is connected with another evenly divided region only at one point. The planes 4 are connected with one another through a power supply wiring pattern 1 so patterned as to enhance high-frequency impedance. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
