发明名称 MANUFACTURING METHOD OF COPPER CLAD LAMINATED SHEET
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a highly heat-resistant copper clad laminated sheet, which uses an extremely thin copper foil, having no flaw or wrinkles and suitably used for fine patterning. <P>SOLUTION: The manufacturing method of the copper clad laminated sheet, which is constituted by laminating the extremely thin copper foil at least on one side of a heat-resistant adhesive film, comprises a process (1) for bonding the heat-resistant adhesive film and the extremely thin copper foil with a carrier, which has at least the carrier and an extremely thin copper foil and is constituted so as to be capable of peeling the carrier and the extremely thin copper foil even after heating at 250°C or above, under heating and pressure, and a process (2) for peeling the carrier in this order. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006256100(A) 申请公布日期 2006.09.28
申请号 JP20050076618 申请日期 2005.03.17
申请人 TORAY IND INC 发明人 NOMURA TAKASHI;YAMAMOTO TETSUYA;KAMEI RYUICHI
分类号 B29C65/20;B29K79/00;B29L9/00;H05K3/38 主分类号 B29C65/20
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