| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive copper paste capable of, as a main part of a conductive filler, manufacturing a conductive adhesive layer showing excellent conductivity by using copper particles, with the formed conductive adhesive layer capable of keeping excellent conductivity for a long period. SOLUTION: Low melting-point alloy particles are used as well by less amount than copper particles. A thermo-curable phenol resin of a binder resin is added with flux agent, a trace amount of flux activity suppressing agent, and chelating agent. A conductive copper paste is thus configured. So, before curing of the binder resin, a low melting-point alloy having a low melting-point dissolves, to fill the gap among copper particles, forming metal bonding. Then, when the temperature rises for thermo-curing of resin, the flux activity suppressing agent reacts with the flux active component to lose activity of the flux, providing a conductive copper paste for manufacturing a conductive adhesive layer excellent in conductivity and anti-oxidation characteristics. COPYRIGHT: (C)2006,JPO&NCIPI
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