| 摘要 |
A heatsink for removing heat from a heat source such as an integrated circuit, a power supply, or a microprocessor. The heatsink includes a base having an airflow passage. The base is also adapted to contact at least a portion of the heat source. The heatsink further includes a pad placed in thermal contact with the base. The pad is configured with an array of individual conduits positioned over the airflow passage of the heatsink base. The array of individual conduits permit air to flow from the airflow passage, through the array of conduits.
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