| 摘要 |
<P>PROBLEM TO BE SOLVED: To fabricate a high-frequency transmission line such as a microstrip line without using a dielectric layer even in a semiconductor integrated circuit board, especially, a silicon integrated circuit board with respect to the high-frequency transmission line. <P>SOLUTION: The high-frequency transmission line is provided with a ground electrode 13 formed on a semiconductor substrate 11; and a transmission line 15 opposing the ground electrode 13 with a gap sandwiched, and supported by a line supporter 17 on the surface opposite to the opposing surface with a line supporter insulating layer 16 sandwiched. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
