| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method for reducing manufacturing costs and improving reliability. <P>SOLUTION: A heat spreader 9 is mounted to a semiconductor element 5. The area of the surface on the semiconductor element 5 side of the heat spreader 9 is nearly identical to that of the surface on the heat spreader 9 side of the semiconductor element 5. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
