发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To achieve flash lamp annealing method that does not damage a Si wafer. SOLUTION: A light source is disposed above a substrate including a single crystal semiconductor region, the substrate is heated by the light radiated from the light source, and the 1/2 pulse width of the light source is set at 1 millisecond or less. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006261695(A) 申请公布日期 2006.09.28
申请号 JP20060141936 申请日期 2006.05.22
申请人 TOSHIBA CORP 发明人 ITO TAKAYUKI;SUGURO KYOICHI
分类号 H01L21/265;H01L21/26 主分类号 H01L21/265
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