| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for removing moisture in a vacuum container at a high rate. SOLUTION: Substrate treatment equipment 1 comprises a process ship 11 which comprises plasma treatment equipment 100 performing RIE treatment, and a load lock module 27 for delivering a wafer W to the plasma treatment equipment 100. The plasma treatment equipment 100 has an aluminium tubular chamber 111 having an alumite coating on the inner wall wherein a gas introduction shower head 132 is arranged on the ceiling of the chamber 111. A system controller of the plasma treatment equipment 100 exhausts the chamber 111 by means of a TMP 116 and a DP 117 after the chamber 111 is opened to the atmosphere and then a lid is closed and introduces gas from which moisture is removed, i.e. the mixture gas of CF<SB>4</SB>and CO, from the gas introduction shower head 132 if the content of moisture in the chamber 111 is not lower than a predetermined level. COPYRIGHT: (C)2006,JPO&NCIPI
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