发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus high in safety causing no defect or breakage of a gas inlet nozzle when coupling a gas supply tube with the gas inlet nozzle in the substrate processing apparatus. SOLUTION: The substrate processing apparatus includes a processing pipe 1 for storing a substrate, the gas inlet nozzle 11 for leading a required treatment gas into the processing pipe and having an external end 12 extending through the wall of the processing pipe out of the pipe, a gas supply pipe 13 for supplying the treatment gas to the gas inlet nozzle, and a coupling member 15 for coupling the external end with the gas supply pipe. Further, a spacer 68 is provided between the coupling member and an external surface of the processing pipe. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006261310(A) 申请公布日期 2006.09.28
申请号 JP20050075149 申请日期 2005.03.16
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 ITO TAKESHI
分类号 H01L21/3065;H01L21/22;H01L21/31;H01L21/324 主分类号 H01L21/3065
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