| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate for a flexible print wiring board which can improve an initial adhesive force between a polyimide resin layer and a copper foil and reduce a drop in adhesive force after application of thermal load as much as possible, and which is superior in durability and is applicbale for fine pitch wiring working. SOLUTION: The method for manufacturing the laminate for the flexible print wiring board is used to form a polyimide resin layer on a copper foil by coating a polyimide precursor resin solution on a copper foil wherein Ni and Zn are adhered to at least its surface, heating it in an atmosphere with an oxygen concentration of 1-10 vol%, and drying and curing the polyimide precursor resin solution. The lamination board obtained through such the method is held at 150°C for 168 hours, and a peeling adhesive force in a 90°direction of the copper foil is 1.0 kN/m or more. COPYRIGHT: (C)2006,JPO&NCIPI
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