| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductor small in die wear in sealing and molding a semiconductor device, having a high heat conductivity and a high reliability to wet resistance. SOLUTION: The invention relates to the epoxy resin composition comprising (A) the epoxy resin, (B) a phenol resin, (C) a hardening accelerator and (D) magnesium oxide surface treated by an inorganic compound, wherein the cured product of the resin composition preferably, has 0.1-1 wt%. of water absorption in soaking in boiling water for 24 hrs at 100°C. COPYRIGHT: (C)2006,JPO&NCIPI
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