发明名称 WIRE-SHAPED SOLDER FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an extrafine wire solder in which the quantity of flux residue is reduced, and which has excellent wettability as well. SOLUTION: The surface of extrafine wire solder is coated with a nonionic surfactant, and the surface thereof is coated with flux. Since the contact reaction between the flux and solder base can be eliminated and the denaturation of the flux caused by the reaction with the solder base can be evaded, deterioration in flux performance and increase in the quantity of flux residue by the non-gasification of the denatured components thereof can be prevented accordingly. In a form where the surface of flux-cored extrafine wire solder is coated with a nonionic surfactant, the oxidation of the surface in the solder wire can be prevented, and the quantity of the flux can be reduced accordingly, or weakly active flux can be used, thus the quantity of flux residue can be reduced, or the flux can be made into a non-electrolyte. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006255762(A) 申请公布日期 2006.09.28
申请号 JP20050078582 申请日期 2005.03.18
申请人 UCHIHASHI ESTEC CO LTD 发明人 MITSUI TOMOKUNI
分类号 B23K35/14;B23K35/22;B23K35/26;B23K35/28;C22C13/00;C22C13/02;C22C18/04;H05K3/34 主分类号 B23K35/14
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