Encapsulation of semiconductor component with chip on substrate in mould tool of top and bottom half after fitting elastic cover over chip

摘要

Semiconductor component consists of chip(s) (5) on substrate (4) and encapsulation starts with fitting elastic cover (11) onto chip. Chip on substrate is then located into moulding tool (15) with lower (14) and top tool part (2).Moulding tool is then closed to completely contact elastic cover with its top inner surface. Then semiconductor component is cast in injection moulding mass. Preferably, chip is fastened on substrate, e.g. by gluing. Independent claims are included for semiconductor component.