Semiconductor device for use as digital memory device, has semiconductor chip comprising bond wire guiding unit in edge area of top side of chip, where guiding unit has structures for guiding bond wire

摘要

The device has a semiconductor chip (5) comprising contact surfaces on its top side. The chip is fixed on a circuit carrier (8) with its rear side, where the carrier has contact terminal areas (9) around the chip. The areas (9) are in electrical connection with the contact surfaces by a bond wire (4). The chip has a bond wire guiding unit (12) in an edge area of the top side. The guiding unit has structures for guiding the wire. An independent claim is also included for a method for manufacturing a semiconductor device.