| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulating heat transfer sheet in which a circuit layer mounting a heat generator such as a semiconductor chip is provided on one face, and a heat sink is provided on the other face, respectively; heat on the heat generator side can be efficiently conducted to the heat sink side for heat radiation; and further, even if a heat deformation is applied by an action of a temperature cycle, etc., a stable performance can be achieved ranging over a long term. SOLUTION: The insulating heat transfer sheet comprises a base metal 5 formed with a thermosetting resin, and a diamond particle 6 disposed to a plane direction of the base metal 5. The diamond particle 6 is projected into high temperature conductor layers 2, 3 by heating and pressurization on both faces of the base metal 5, and also, an insulation and heat conductivity are ensured between the high temperature conductor layers 2, 3. COPYRIGHT: (C)2006,JPO&NCIPI
|
