| 摘要 |
PROBLEM TO BE SOLVED: To provide a board design support device, a method, and a program, wherein a displacement caused by a temperature change can be easily predicted at a low cost even in a printed wiring board which is complicated in shape and structure. SOLUTION: The printed wiring board design support program comprises a mesh division step to divide the analysis model of the printed wiring board acquired as data into meshes, a mesh displacement calculating step to calculate the displacement of each mesh of the printed wiring board which is divided into the meshes at the preceding mesh division step, a mesh displacement connection step to connect the displacement calculated at the preceding mesh displacement calculating step so as to make the slopes of the mesh edges continued, and a displacement calculating step to calculate the displacement from the total displacement of the printed wiring board obtained at the preceding mesh displacement connection step. All the steps are executed through a computer. COPYRIGHT: (C)2006,JPO&NCIPI
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