发明名称 |
ALUMINUM CAP WITH ELECTROLESS NICKEL/IMMERSION GOLD |
摘要 |
A resulting solder bump structure comprising the following steps. A structure having a metal bond pad formed thereover is provided. A patterned cover layer is formed over the structure. The patterned cover layer including an opening exposing a portion of the metal bond pad. The patterned cover layer opening including side walls. A metal cap layer is formed over at least the exposed portion of the metal bond pad and the patterned cover layer side walls. A solder bump is formed over the metal cap layer. |
申请公布号 |
US2006214310(A1) |
申请公布日期 |
2006.09.28 |
申请号 |
US20060422585 |
申请日期 |
2006.06.06 |
申请人 |
CHARTERED SEMICONDUCTOR MANUFACTURING LTD. |
发明人 |
LO MARVIN |
分类号 |
H01L23/48;H01L21/60;H01L23/485 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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