| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a DIP semiconductor device which allows the size reduction. <P>SOLUTION: The DIP semiconductor device 1 incorporates a rectangular IC chip 4, inner leads 5 standing in a dual line in each inline direction with their top ends opposed to the both sides of the IC chip 4, pads 6 attached along an inline direction on the IC chip 4, and bonding wires 7 used for wiring between the inner leads 5 and the pads 6. The pads 6 are shifted to the inner side in the row direction of the IC chip 4 to accommodate a bonding loop length required for wire bonding of the bonding wires 7. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
