| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a manufacturing cost of a semiconductor device structured to cover with resin a semiconductor chip provided on a surface of a circuit board via a hollow cavity. <P>SOLUTION: A lid frame 7 to be used in the semiconductor device 1 is structured to cover with resin the semiconductor chip 5 fixed to overlie on one end in the thickness direction of the circuit board 3 and electrically connected therewith via the hollow cavity 25. It includes a lid 17 provided at one end of the circuit board 3 to cover the semiconductor chip 5 to form the cavity 25, and a protrusion 19 protruding from the lid 17 out of the cavity 25. The protrusion 19 extends further from the upper end 21 of the lid 17 in the thickness direction. The lid frame 7 thus constituted is provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
