| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a dicing saw tape frame whose shape is not changed even after surface polishing, and capable of cutting chips from a wafer at a high yield. <P>SOLUTION: The dicing saw tape frame is produced from a subzero-treated type high strength stainless steel sheet in which the difference in surface residual stress between the front and rear is controlled to±100 MPa. The stainless steel sheet comprises, by mass, 0.09 to 0.17% C,≤1.0% Si,≤1.5% Mn, 4.0 to 7.0% Ni, 14.0 to 17.0% Cr,≤0.10% N and 0.001 to 0.010% B, and the components are also regulated in such a manner that AHV=985-135C-14Si-30Mn-43Ni-29Cr-265N≤250, and SHV=1882-255C-43Si-101Mn-70Ni-55Cr-921N≥350 are satisfied. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
