| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer processing tape exhibiting good expandability and good cutting properties in which impact of dicing chips on a semiconductor chip is suppressed. SOLUTION: An adhesive layer is formed on a substrate and then a layer coated with adhesive, an intermediate layer, and an expand ring contact layer are formed sequentially thereon to produce a semiconductor wafer processing tape wherein the layer coated with adhesive is composed of resin composition containing 10-25 mass% of styrene-butadiene copolymer added with hydrogen. COPYRIGHT: (C)2006,JPO&NCIPI |
