| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a high-frequency semiconductor package which is hardly affected by parasitic inductance or parasitic capacity, accordingly exhibits small transmission loss, and exhibits a high degree of electromagnetic compatibility. SOLUTION: The substrate for package is provided with: a core substrate 1 which is made of conductive metal and is provided with holes 1A into which coaxial cables 2 covered with a shield coating 2A can be inserted; the coaxial cables 2 whose ends are inserted into the holes 1A, and whose shield coating 2A is electrically connected to the peripheral borders of the holes 1A; an insulating resin 3 which fills the two faces of the core substrate 1 into which the ends of the coaxial cables 2 are inserted, and which has a surface exhibiting the same plane as the ends of the coaxial cables 2; and electrode pads 4 which are formed on the edges of center conductors 3B at the ends of the coaxial cables 2 which appear on the same plane as the insulating resin 3. COPYRIGHT: (C)2006,JPO&NCIPI |
