| 摘要 |
PROBLEM TO BE SOLVED: To accurately and quickly form a bump and a probe card for contacting electrically with an electric component. SOLUTION: This probe card has a plurality of conductors 12 for transmitting an electric signal used for inspection, and the bump 18 formed respectively on the plurality of conductors, and for contacting mechanically with the electric component. The bump 18 has a lower portion fused to the conductors, and an upper portion die-molded into a thin-tip shape reduced in a cross-sectional area along with approach to a tip of the bump. The bump 18 has further an elastomer for pressing the bump onto the electric component. The bump 18 has further a flexible substrate 54 pressed toward a direction of the electric component by the elastomer. Each of the plurality of conductors 12 has a reverse face bonded to the substrate, and a surface provided with the bump. A surface of the bump 18 is plated with a substance of high hardness having hardness higher than that of the upper portion. COPYRIGHT: (C)2006,JPO&NCIPI
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