| 摘要 |
A semiconductor device having improved mounting reliability is provided by permitting a bonding part of an external connecting terminal on a substrate to have a stress modifying structure. The semiconductor device is provided with the substrate having an internal connecting terminal connected with the external connecting terminal through an electrode pad; a semiconductor element, which is arranged on the substrate and connected with the internal connecting terminal; and a sealing resin for sealing the semiconductor element. A substrate portion, which faces a portion whereupon the external connecting terminal is mounted on the electrode pad on a rear plane of the substrate, is formed of a cavity or a soft substance. |
