| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME |
| 摘要 |
A base (3) made of a resin is formed on a printed wiring board (1). An adhesive (4) is applied on the base (3), and an IC chip (5) is placed and fixed thereon. Then, the IC chip (5) is encapsulated with a BGA type package resin (7). The base (3) and the package resin (7) are composed of the same resin. |
| 申请公布号 |
WO2006100738(A1) |
申请公布日期 |
2006.09.28 |
| 申请号 |
WO2005JP05021 |
申请日期 |
2005.03.18 |
| 申请人 |
FUJITSU LIMITED;NAGAI, KOUICHI |
发明人 |
NAGAI, KOUICHI |
| 分类号 |
H01L23/29;H01L21/52;H01L23/12;H01L23/31 |
主分类号 |
H01L23/29 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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