发明名称 Substrate for stressed systems and method of making same
摘要 A stress absorbing microstructure assembly including a support substrate having an accommodation layer that has plurality of motifs engraved or etched in a surface, a buffer layer and a nucleation layer. The stress absorbing microstructure assembly may also include an insulating layer between the buffer layer and the nucleation layer. This assembly can receive thick epitaxial layers thereon with concern of causing cracking of such layers.
申请公布号 US2006216849(A1) 申请公布日期 2006.09.28
申请号 US20060434930 申请日期 2006.05.17
申请人 S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES S.A. 发明人 LETERTRE FABRICE;GHYSELEN BRUNO;RAYSSAC OLIVIER
分类号 H01L21/00;H01L21/20;H01L21/30 主分类号 H01L21/00
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