| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for packaging an LED to a printed-wiring board for facilitating miniaturization by increasing packaging density in the LED, and for extending the lifetime of the LED by increasing heat radiation effect, and to provide an LED packaging printed-wiring board. <P>SOLUTION: In the method for packaging the LED, a recess in a truncated cone shape having a section in an inverted trapezoidal shape having a wiring circuit is created on a metal substrate that also serves as a heat sink and has improved heat conduction, an LED bare chip 2 is loaded for fixing and wiring, the upper surface of the bare chip is sealed by a transparent material, such as glass, acryl, silicone, epoxy, and polycarbonate, and a transparent plate is set to be in a flat or convex lens shape. A metal substrate is exposed to the sidewall of a recess in a truncated cone shape having a section in an inverted trapezoidal shape or a metal film is formed, and emitted rays from the LED bare chip to the sidewall of the cess are reflected so that they go in the direction of the front. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
