| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive and an adhesive for connecting circuits, each exhibiting high adhesive strength despite a radical curing system, having stable performance even after reliability test and further, excellent in storage stability and a connecting body and a semiconductor device. <P>SOLUTION: The adhesive comprises (a) a thermoplastic resin, (b) a radically polymerizable substance containing a structure represented by general formula (B) (wherein M is an integer of 0-10; N is an integer of 1-20) and/or general formula (C) and having two or more (meth)acryloyl groups and two or more urethane bonds in the molecule and (c) a radical polymerization initiator. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
