| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To enhance the electric connection reliability between a Cu conductor film, chief of which is Cu, which is formed on an insulation film and a via conductor containing Ag which is extended through the insulation film in the thickness direction thereof and is electrically connected to the Cu conductor film, in a wiring board. <P>SOLUTION: AgSn alloy powder containing Ag7 and Sn4 is used as a conductive component of the via conductor 3. An Sn plating film 8 is formed in a region in contact with the via conductor 3 on the Cu conductor film 2. As a result, a Cu-Sn intermetallic component 6 is formed along the interface between the Cu conductor film 2 and the Sn plating film 8 while an Ag-Sn intermetallic compound is formed along the interface between the via conductor 3 and the Sn plating film 8, resulting in an increase in electric connection reliability between the Cu conductor film and the via conductor. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
