| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a power amplifier module suppressed in deterioration in high frequency characteristics caused by a conductive wire serving as a signal transmission path falling down in resin sealing or at the formation of an unfilled part of resin in a metal mold. <P>SOLUTION: The power amplifying module includes a lead frame 11; a circuit board 14 mounted on the lead frame 11 having a through-hole 13 formed at a part of the board, and also having an electronic circuit pattern 12; an electronic component packaged on the circuit board 14; a semiconductor device 15 mounted to the lead frame 11; a first conductive wire 18 for connecting the semiconductor device 15 with the electronic circuit pattern 12; and sealing resin 17 for sealing part of the lead frame 11, the circuit board 14, the electronic component 16, the semiconductor device 15 and the first conductive wire 18. The long side of the component 16 and the first conductive wire 18 are parallel to each other in a plan view. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
