| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive composition improving conductivity as a whole by positively advancing three-dimensional junction among conductor particles, and also to provide a wiring board. SOLUTION: This conductive composition 4 has: a composition containing at least a resin binder 1 hardened by heating; first conductive shape-memory particles 2 having a transformation start temperature lower than the hardening start temperature of the resin binder 1 and having a shape stretching at a temperature above the transformation start temperature; and second conductive shape-memory particles 3 having a transformation start temperature lower than the hardening start temperature of the resin binder 1 and having a shape contracting at a temperature above the transformation start temperature. By this structure, the shape-memory particles are entwined with one another, whereby a conductor wire having low resistance and a via conductor is formed, to form the wiring board and a multilayered wiring board using it. COPYRIGHT: (C)2006,JPO&NCIPI |
