发明名称 EVAPORATIVE COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an evaporative cooling device capable of uniformly and efficiently evaporatively cooling a whole of an article to be cooled. SOLUTION: A tube 2 in penetrated through the inside of a cylindrical shell 1 to form a division chamber 3. An article to be cooled feeding pipe 5 is connected to an entrance part 4 of the tube 2. A cooling fluid reservoir 8 is formed on an outer periphery of the division chamber 3. A plurality of cooling fluid spraying nozzles are arranged at a border part of the cooling fluid reservoir 8 and the division chamber 3. When the tube 2 is cooled, the cooling fluid is fed to the whole of the tube 2 by spraying the cooling fluid from the cooling fluid feeding pipes 11, 12 and the cooling fluid reservoir 8 into the division chamber 3 and the article to be cooled can be evaporatively cooled without unevenness. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006258318(A) 申请公布日期 2006.09.28
申请号 JP20050072724 申请日期 2005.03.15
申请人 TLV CO LTD 发明人 MORII TAKAYUKI
分类号 F25D7/00 主分类号 F25D7/00
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