Flip-chip semiconductor package and method for fabricating the same

摘要

A flip-chip semiconductor package and a method for fabricating the same are proposed. A flux is formed on surfaces of solder bumps mounted on an active surface of a semiconductor chip, wherein the acid number of the flux is greater than 20 and the viscosity of the flux is greater than 40. When the chip is electrically connected to a lead frame via the solder bumps by a reflowing process, the flux allows the chip to be effectively fixed to the lead frame and makes the solder bumps not easily wetted to the lead frame during the reflowing process, so as to prevent over-collapsing of the solder bumps.